CanMV-K230 Introduction
About 1 min
Overview
The CanMV-K230 development board is based on the latest-generation K230 series AIoT SoC from Canaan Technology's Kendryte® AIoT chip family. The chip adopts a new multi-heterogeneous-unit accelerated computing architecture, integrating 2 high-efficiency RISC-V compute cores and a next-generation KPU (Knowledge Process Unit) for multi-precision AI computing. It widely supports general AI computing frameworks, with utilization exceeding 70% on some typical networks.
The chip also supports rich peripheral interfaces and integrates dedicated hardware acceleration units such as 2D and 2.5D engines, enabling acceleration of image, video, audio, and AI workloads with low latency, high performance, low power consumption, and fast boot.
Hardware Description
System Block Diagram
Specifications
- CPU: CPU1: RISC-V processor, 1.6GHz, 32KB I-cache, 32KB D-cache, 256KB L2 Cache, 128-bit RVV1.0 extension
CPU0: RISC-V processor, 0.8GHz, 32KB I-cache, 32KB D-cache, 128KB L2 Cache - KPU: Supports INT8 and INT16
Typical network performance: Resnet50 ≥ 85fps@INT8; Mobilenet_v2 ≥ 670fps@INT8; YoloV5S ≥ 38fps@INT8 - DPU: 3D structured-light depth engine, max resolution 1920×1080
- VPU: H.264 and H.265 encoder/decoder, max resolution 4096×4096
Encoder performance: 3840×2160@20fps
Decoder performance: 3840×2160@40fps
JPEG codec: Supports up to 8K (8192×8192) resolution - Image input: Up to 3 MIPI CSI channels (1×4-lane + 1×2-lane) or 3×2-lane
- Display output: 1 MIPI DSI, 1×4-lane or 1×2-lane
Max resolution 1920×1080@60fps - On-chip interfaces: 5 × UART
5 × I2C
6 × PWM
64 × GPIO + 8 × PMU GPIO
2 × USB 2.0 OTG
2 × SDxC: SD3.01, eMMC 5.0
3 × SPI: 1× OSPI + 2 × QSPI
WDT/RTC/Timer
Renderings
Dimensions
Schematics
